Rink Technology


CMP Retaining Rings

CMP (Chemical Mechanical Polishing)
a process for planarization of wafers is nowadays an itegral part in every semiconductor production facility. This step is done before patterning the wafer to provide a flat surface for exposing different mask images on.Pressure is applied to the wafer cover usually with a slurry which will polish the wafer as well so called retaining rings are used to keep the wafer in position during the polishing process.
We offer different types of retaining rings established in the Industry, just contact us for more detailed infos or inquiries.